| Sign In | Join Free | My xxjcy.com |
|
AI Intelligent Chassis : Dual-Chamber Air Suspension + Electromagnetic Active Variable Damping Shock Absorbers, 100 mm height adjustment, 50% stiffness adjustment
Cockpit Chip : Qualcomm Snapdragon SA8295P
Body Dimensions : 4891 mm × 1937 mm × 1670 mm
Wheelbase : 2998 mm
Trunk Volume : 754 L (normal), 1795 L (expanded)
Smart Driving Hardware : XPENG's in-house developed "Turing AI Chips", optional upgrade to 2250 TOPS
|
|
The 2026 Xiaopeng G9 Electric SUV with 2250 TOPS Computing Power, 800V High-Voltage SiC Platform, and Dual-Chamber Air Suspension Images |